Introduction of low pressure injection molding process:
Low pressure injection molding process is a very low injection pressure (1.5 ~ 40 bar) into the mold and rapid curing molding (5 ~ 50 seconds) encapsulation process method to achieve insulation, temperature resistance, impact resistance, vibration damping, moisture, water, dust, chemical corrosion resistance, etc. KY low pressure injection molding special injection plastic as packaging materials, mainly used in precision, sensitive electronic components of The encapsulation and protection of electronic components, including: printed circuit boards (PCB), automotive electronics, cell phone batteries, wire harnesses, waterproof connectors, sensors, micro-switches, inductors, antennas, coils, ring cable, etc.
Applications in the electronic automotive industry:
Deflection coil, power supply, main board and other parts and connection line fixing; high-tech industry and microelectronics applications; packaging, placement and module molding of electronic components; edge seam bonding and sealing of metal casing; semiconductor connector and filter integrated molding; electronic material shielding, heat shrinkable casing, automotive interior, seats, lamps.
Low pressure molding technology applications:
Waterproofing of components such as circuit boards and connectors; insulation of electronic components; mechanical protection of electronic components; temperature-resistant component applications; low-flammability products requiring UL certification; products requiring chemical neutrality; environmentally friendly products.
